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 DATASHEET
SERIAL PROGRAMMABLE QUAD PLL VERSACLOCK SYNTHESIZER Description
The ICS308 is a versatile serially programmable, quad PLL clock source. The ICS308 can generate any frequency from 250 kHz to 200 MHz, and up to 6 different output frequencies simultaneously. The outputs can be reprogrammed on the fly, and will lock to a new frequency in 10 ms or less. Smooth transitions (in which the clock duty cycle remains roughly 50%) are guaranteed if the output divider is not changed. The device includes a PDTS pin which tri-states the output clocks and powers down the entire chip. The ICS308 default for non-programmed start-up are buffered reference clock outputs on all clock output pins.
ICS308
Features
* * * *
Packaged in 20-pin SSOP (QSOP) Available in Pb (lead) free package Operating voltage of 3.3 V Highly accurate frequency generation
* M/N Multiplier PLL: M = 1..2048, N = 1..1024 * Serially programmable: user determines the output
frequency via a 3-wire interface
* Eliminates need for custom quartz oscillators * Input crystal frequency of 5 - 27 MHz *Optional programmable on-chip crystal capacitors * Output clock frequencies up to 200 MHz * Reference clock output * Power down tri-state mode * Very low jitter
Block Diagram
V DD 3
CLK1
P LL1
CLK2 Divide Logic and Output Enable Control CLK3 CLK4 CLK5 CLK6 CLK7 CLK8 CLK9
STROBE SCLK DATA
P LL3 C rystal or clock input X 1/IC LK C rystal O scillator X2 GND 2 P D TS P LL4 P LL2
E xternal capacitors are required w ith a crystal input.
IDTTM / ICSTM SERIAL PROGRAMMABLE QUAD PLL VERSACLOCK SYNTHESIZER 1
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Pin Assignment
D AT A X2 X1/IC LK C LK9 VDD GND C LK1 C LK2 C LK3 C LK4 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 ST R O BE SC LK PD T S VD D VD D GND C LK5 C LK6 C LK7 C LK8
20 pin (150 m il) SSOP (QSOP)
Pin Descriptions
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pin Name DATA X2 X1/ICLK CLK9 VDD GND CLK1 CLK2 CLK3 CLK4 CLK8 CLK7 CLK6 CLK5 GND VDD VDD PDTS SCLK STROBE Pin Type Input XO XI Output Power Power Output Output Output Output Output Output Output Output Power Power Power Input Input Input Serial data input. Crystal Output. Connect this pin to a crystal. Float for clock input. Connect this pin to a crystal or external clock input. Output clock 9. Default of Reference frequency output when unprogrammed. Connect to +3.3 V. Connect to Ground. Output clock 1. Default of Reference frequency output when unprogrammed. Output clock 2. Default of Reference frequency output when unprogrammed. Output clock 3. Default of Reference frequency output when unprogrammed. Output clock 4. Default of Reference frequency output when unprogrammed. Output clock 8. Default of Reference frequency output when unprogrammed. Output clock 7. Default of Reference frequency output when unprogrammed. Output clock 6. Default of Reference frequency output when unprogrammed. Output clock 5. Default of Reference frequency output when unprogrammed. Connect to Ground. Connect to +3.3 V. Connect to +3.3 V. Powers down entire chip, tri-states all outputs when low. Internal pull-up. Serial Shift register clock. See timing diagram. Strobe to load data. See timing diagram. Use external 250 kOhm pull-up. Pin Description
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Configuring the ICS308
Initial State: The ICS308 may be configured to have up to nine frequency outputs, utilizing the four on-board PLLs. Unprogrammed, the part has the following outputs, related to the reference input clock:
Default Outputs Output
Clock 1-9 (Pins 4, 10 - 14)
Frequency
Reference Output
The STROBE pin must have an external 250 kOhm pull-up resistor to achieve the Initial State. The input crystal range for the ICS308 is 5 MHz to 27 MHz. The ICS308 can be programmed to set the output functions and frequencies. 160 data bits generated by the VersaClockTM software are written in DATA pin in this order: MSB (left most bit) first. As show in Figure 2, after these 160 bits are clocked into the ICS308, taking STROBE high will send this data to the internal hatch and the CLK output will lock within 10 ms. Note: STROBE utilizes a transparent latch that is latched when in the high state. If STROBE is in the high state and SCLK is pulsed, DATA is clocked directly to the internal latch and the output conditions will change accordingly. Although this will not damage the ICS308, it is recommended that STROBE be kept low while DATA is being clocked into the ICS308 in order to avoid unintended changes on the output clocks. All outputs may be turned off during initialization by bringing the PDTS pin to Ground. When PDTS is brought high, after the Strobe pin in brought high, the programmed output frequencies will be available.
AC Parameters for Writing to the ICS308
Parameter tSETUP tHOLD tW tS Condition Setup time Hold time after SCLK Data wait time Strobe pulse width SCLK Frequency Min. 10 10 10 40 30 Max. Units ns ns ns ns MHz
DATA t setup
Bit160
Bit159
Bit158
t hold
Bit3
Bit2
Bit1
SCLK tw STROBE ts
Figure 2. Tim ing Diagram for Program m ing the ICS308
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External Components
Series Termination Resistor
Clock output traces over one inch should use series termination. To series terminate a 50 trace (a commonly used trace impedance), place a 33 resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20 . to the VDD pin as possible. No vias should be used between decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. 3) To minimize EMI, the 33 series termination resistor (if needed) should be placed close to each clock output. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers.
STROBE Pull-up Resistor
In order for the device to start up in the default state, a 250 kOhm pull-up resistor is required.
Decoupling Capacitors
As with any high-performance mixed-signal IC, the ICS308 must be isolated from system power supply noise to perform optimally. Decoupling capacitors of 0.01F must be connected between each VDD and the PCB ground plane.
ICS308 Configuration Capabilities
The architecture of the ICS308 allows the user to easily configure the device to a wide range of output frequencies, for a given input reference frequency. The frequency multiplier PLL provides a high degree of precision. The M/N values (the multiplier/divide values available to generate the target VCO frequency) can be set within the range of M = 1 to 2048 and N = 1 to 1024. The ICS308 also provides separate output divide values, from 2 through 20, to allow the two output clock banks to support widely differing frequency values from the same PLL. Each output frequency can be represented as: Output Freq. = (Ref. Freq)*(M/N)/Output Divide
Crystal Load Capacitors
The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 20 pF [(16-6) x 2 = 20].
PCB Layout Recommendations
For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) Each 0.01F decoupling capacitor should be mounted on the component side of the board as close
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VersaClock Software
IDT applies years of PLL optimization experience into a user friendly software that accepts the user's target reference clock and output frequencies and generates the lowest jitter, lowest power configuration, with only a press of a button. The user does not need to have prior PLL experience or determine the optimal VCO frequency to support multiple output frequencies. VersaClock software quickly evaluates accessible VCO frequencies with available output divide values and provides an easy to understand, bar code rating for the target output frequencies. The user may evaluate output accuracy, performance trade-off scenarios in seconds.
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS308. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Parameter
Supply Voltage, VDD Inputs Clock Outputs Storage Temperature Soldering Temperature
Item
Referenced to GND Referenced to GND Referenced to GND Max 10 seconds
Min.
-0.5 -0.5 -65
Typ.
Max.
7 VDD+ 0.5 VDD+ 0.5 150 260
Units
V V V C C
Recommended Operation Conditions
Parameter
Ambient Operating Temperature (ICS308R) Ambient Operating Temperature (ICS308RI) Power Supply Voltage (measured in respect to GND) Power Supply Ramp Time
Min.
0 -40 +3.0
Typ.
Max.
+70 +85 +3.6 4
Units
C C V ms
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DC Electrical Characteristics
VDD=3.3 V 10%, Ambient temperature -40 to +85 C, unless stated otherwise
Parameter
Operating Voltage Operating Supply Current Input High Voltage
Symbol
VDD IDD
Conditions
Configuration Dependent Ex. 25 MHz crystal, VDD=3.3 V, No load, PDTS = 0
Min.
3.00
Typ.
Max.
3.60
Units
V mA
25 20 (VDD/2)+1 (VDD/2)-1 VDD-0.5 0.8 2.4 0.4 VDD-0.4 +70 4 525 250
mA A V V V V V V V mA pF k k
Input High Voltage Input Low Voltage Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage Output High Voltage, CMOS level Short Circuit Current Input Capacitance Internal Pull-down Resistor Internal Pull-up Resistor
VIH VIL VIH VIL VOH VOL VOH
X1/ICLK only X1/ICLK only PDTS, SRCLOCK, DATA, STROBE IOH = -8 mA IOL = 8 mA IOH = -4 mA CLK outputs
CIN RPD RPU
PDTS pin CLK outputs PDTS pin
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AC Electrical Characteristics
VDD = 3.3 V10%, Ambient Temperature -40 to +85 C, unless stated otherwise
Parameter
Input Frequency
Symbol
FIN
Conditions
Fundamental crystal Input Clock VDD=3.3 V
Min.
5 2 0.25
Typ.
Max. Units
27 50 200 MHz MHz MHz ns ns 60 10 2 % ms ms ps ps
Output Frequency Output Clock Rise Time Output Clock Fall Time Output Clock Duty Cycle Power-up Time tOR tOF
20% to 80%, Note 1 80% to 20%, Note 1 Note 2 STROBE goes high until stable CLK out PDTS goes high until stable CLK out 40
0.8 0.8 49-51 3 .2 300 200
Maximum Output Jitter, short term Maximum Output Jitter, short term
tj tj
Reference Clock All other clocks, CL=15 pF, configuration dependent Low Skew Outputs -250
Pin-to-Pin Skew
250
ps
Note 1: Measured with 15 pF load. Note 2: Duty Cycle is configuration dependent. Most configurations are min 45% / max 55%
Thermal Characteristics
Parameter
Thermal Resistance Junction to Ambient
Symbol
JA JA JA JC
Conditions
Still air 1 m/s air flow 3 m/s air flow
Min.
Typ.
135 93 78 60
Max. Units
C/W C/W C/W C/W
Thermal Resistance Junction to Case
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Package Outline and Package Dimensions (20-pin SSOP, 150 Mil. Wide Body)
Package dimensions are kept current with JEDEC Publication No. 95
20
Millimeters Symbol Min Max
Inches* Min Max
E1 INDEX AREA
E
12 D
A A1 A2 b c D E E1 e L aaa
1.35 1.75 0.10 0.25 -1.50 0.20 0.30 0.18 0.25 8.55 8.75 5.80 6.20 3.80 4.00 .635 Basic 0.40 1.27 0 8 -0.10
0.053 0.069 0.004 0.010 -0.059 0.008 0.012 0.007 0.010 0.337 0.344 0.228 0.244 0.150 0.157 .025 Basic 0.016 0.050 0 8 -0.004
A2 A1
A
*For reference only. Controlling dimensions in mm.
c
-Ce
b SEATING PLANE L
aaa C
Ordering Information
Part / Order Number
ICS308R ICS308RT ICS308RI ICS308RIT ICS308RLF ICS308RLFT ICS308RILF ICS308RILFT
Marking
ICS308R ICS308RI 308RLF 308RILF
Shipping Packaging
Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel
Package
20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP 20-pin SSOP
Temperature
0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C 0 to +70 C 0 to +70 C -40 to +85 C -40 to +85 C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
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www.IDT.com
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800-345-7015 408-284-8200 Fax: 408-284-2775
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www.idt.com/go/clockhelp
Corporate Headquarters
Integrated Device Technology, Inc. www.idt.com
(c) 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA


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